More options
Others who downloaded this publication also downloaded ...
Abstract
The need to integrate heterogeneous environments without replacing existing IT infrastructures is growing more and more. Standard application providers offer a wide range of business applications, running on different platforms, and implemented in different languages. A sophisticated Enterprise Service Architecture is required to overcome the challenges implied by such a heterogeneous infrastructure and make the whole enterprise controllable.
The WebSphere Business Integration architecture provides different Integration brokers and a multitude of application and technology adapters. It is an essential software component in IBM's e-business on demand strategy. SAP Exchange Infrastructure is SAP’s strategic technology platform for process integration and connectivity of SAP components and non-SAP components.
This IBM Redbook illustrates how to integrate data and processes located in SAP back-end systems using WebSphere Business Integration middleware technology. It describes two WebSphere Business Integration adapters:
IBM WebSphere Business Integration Adapter for SAP V5.5.0
IBM WebSphere Business Integration Adapter for SAP Exchange Infrastructure V1.0
These adapters are utilized to demonstrate the integration capabilities they provide.
Table of contents
Part 1. Overview
Chapter 1. Introduction and book structure
Chapter 2. Business Integration technology concepts
Part 2. Business scenario solution design
Chapter 3. Business case scenario
Chapter 4. Solution approaches and technology options
Chapter 5. Solution design
Part 3. Business scenario solution implementation
Chapter 6. Environment setup
Chapter 7. Use Case 1: WBIMB using WBI Adapter for mySAP.com
Chapter 8. Use Case 2: WBISF using WBI Adapter for mySAP.com
Chapter 9. Use Case 3: WICS using WBI Adapter for mySAP.com andJDBC
Chapter 10. Use Case 4: Integration of SAP XI with WBIInterChange Server
Chapter 11. Best practices and lessons learned
Appendix A. Scripts, source, and test data
Appendix B. Additional material
